Description
From high power to high frequency applications AEM™s complete line of chip inductors and beads are an excellent solution for EMI signal filtering.
Multilayer Ferrite Chip Beads
Features:
- Monolithic structure for closed magnetic path and high reliability
- Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216
- A complete set of ferrite and electrode materials providing a wide range of electrical properties
- Superior termination bonding strength
- Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
- RoHS compliant when -T option is specified
Multilayer Ferrite Chip Beads (High Speed)
Features:
- Monolithic structure for closed magnetic path and high reliability
- Standard EIA/EIAJ chip sizes such as 0402/1005, 0603/1608, 0805/2012, and 1206/3216
- Superior termination bonding strength
- Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
- RoHS compliant when -T option is specified
Multilayer Ferrite Power Beads
Features:
- Monolithic structure for closed magnetic path and high reliability
- Maximum permissible currents up to 4A
- Standard EIA/EIAJ chip sizes such as 0603/1608, 0805/2012, and 1206/3216
- Superior termination bonding strength
- Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes
- RoHS compliant when -T option is specified
Multilayer Ceramic Inductors
Features:
- Monolithic structure with high reliability
- Standard EIA/EIAJ chip sizes such as 0402/1005 and 0603/1608
- High quality ceramic material and unique manufacturing processes providing high Q at high frequencies and high self-resonant frequencies
- Superior termination bonding strength
- Nickel barrier with solder overplated termination offering excellent solderability and solder leach resistance, suitable for both wave and reflow soldering processes