Product News

HPDC Series – High Power Density Chip Resistors

21 Januari 2022

2.4W in 1206 – 3.5W in 2512 – Aluminium Nitride substrate

HPDC series resistors use an aluminium nitride (AlN) ceramic substrate with about 6 times the thermal conductivity of alumina, the conventional substrate material. Also, they have large area terminations, improving thermal contact with a PCB.
This results in resistors with very high power density and excellent overload withstand. This product can also serve as a heater in a temperature regulated system.

Features

• Aluminum nitride (AlN) substrate
• Wide area solder terminations
• Offers >3 x standard power density
• Power rating up to 3.5W @70°C
• Tolerance down to 0.5%
• Overload rating up to 7.7W for 5s
• Thick film element

Benefits

• The use of a high power density part reduces the PCB footprint required.
• Low thermal impedance minimises the temperature rise and enhances the reliability of the assembly.
• High overload withstand gives reliable product performance under high momentary load conditions.

Ideal Applications

• Power supply
• Motor drive
• Actuator control
• Active capacitor bleed
• Power amplifier
• Local heater

HPDC Datasheet

HPDC Fast Facts

HPDC Press Release

HPDC Press Release Mandarin

Keyword : #Maxmega, #TTElectronics, #Resistor