TTE – Hybrid Microcircuits


Key capabilities

Turnkey circuit layout and packaging design based on customers’ electrical schematics, and performance and environmental requirements.

Design and manufacture in compliance with MIL-PRF-38534 Class H.

Engineering and program management support.

A broad range of packaging and technologies, including:

  • Hermetic and non-hermetic packaging
  • Multi-layer thick film printing on ceramic (AIO and AIN)
  • High and low temperature co-fi red ceramic (HTCC and LTCC)
  • Thin film
  • Surface mount
  • Bare die and wire bonding (or mixed SMT and With Chip & Wire)

State of the art ‘lean’ manufacturing facilities, including:

  • Class 10,000 clean room facilities in the US and UK
  • Fully automated SMT lines
  • Fully automated die bonding and wire bonding
  • Automated inspection (under development for wire bonding)
  • Custom test systems including full temperature testing
  • Environmental screening to MIL-STD-883, ESA ECSS-Q-ST-60-05 and BS9450

ISO9001:2008 and IS014001:2004 quality management systems Applications


Our diverse range of custom solutions have recently been adopted in the following applications:

  • Aircraft engine control• Airborne phased array radars
  • Aerospace / space inertial measurement units
  • Wing ice protection systems
  • Electronic counter measures
  • Missile fusing / seeker systems
  • Helicopter mission computer systems
  • Minesweeper sonar systems and beacons
  • Suppressor circuits for aircraft lightning protection
  • High voltage mass spectrometer circuits
  • Optical test instrumentation
  • Oil and gas exploration pressure and temperature logging modules