TTE – Hybrid Microcircuits

Description

Key capabilities

Turnkey circuit layout and packaging design based on customers’ electrical schematics, and performance and environmental requirements.

Design and manufacture in compliance with MIL-PRF-38534 Class H.

Engineering and program management support.

A broad range of packaging and technologies, including:

• Hermetic and non-hermetic packaging
• Multi-layer thick film printing on ceramic (AIO and AIN)
• High and low temperature co-fi red ceramic (HTCC and LTCC)
• Thin film
• Surface mount
• Bare die and wire bonding (or mixed SMT and With Chip & Wire)

State of the art ‘lean’ manufacturing facilities, including:

• Class 10,000 clean room facilities in the US and UK
• Fully automated SMT lines
• Fully automated die bonding and wire bonding
• Automated inspection (under development for wire bonding)
• Custom test systems including full temperature testing
• Environmental screening to MIL-STD-883, ESA ECSS-Q-ST-60-05 and BS9450

ISO9001:2008 and IS014001:2004 quality management systems Applications

Applications

Our diverse range of custom solutions have recently been adopted in the following applications:

• Aircraft engine control• Airborne phased array radars
• Aerospace / space inertial measurement units
• Wing ice protection systems
• Electronic counter measures
• Missile fusing / seeker systems
• Helicopter mission computer systems
• Minesweeper sonar systems and beacons
• Suppressor circuits for aircraft lightning protection
• High voltage mass spectrometer circuits
• Optical test instrumentation
• Oil and gas exploration pressure and temperature logging modules